专利名称：SEMICONDUCTOR CHIP ASSEMBLY AND
METHOD FOR MAKING SAME
发明人：Teck-Gyu Kang,Wei-Shun Wang,Hiroaki
Sato,Kiyoaki Hashimoto,YoshikuniNakadaira,Norihito Masuda,BelgacemHaba,Ilyas Mohammed,Philip Damberg
申请号：US13157722申请日：20110610
公开号：US20120155055A1公开日：20120621
专利附图：
摘要：A microelectronic assembly may include a substrate including a rigid dielectriclayer having electrically conductive elements, a microelectronic element having a pluralityof contacts exposed at a face thereof, and conductive vias extending through a compliantdielectric layer overlying the rigid dielectric layer. The vias electrically connect thesubstrate contacts respectively to the conductive elements, and the substrate contactsare joined respectively to the contacts of the microelectronic element. The vias,compliant layer and substrate contacts are adapted to appreciably relieve stress at thesubstrate contacts associated with differential thermal contact and expansion of theassembly.
申请人：Teck-Gyu Kang,Wei-Shun Wang,Hiroaki Sato,Kiyoaki Hashimoto,YoshikuniNakadaira,Norihito Masuda,Belgacem Haba,Ilyas Mohammed,Philip Damberg
地址：San Jose CA US,Palo Alto CA US,Yokohama JP,Yokohama JP,Hodogaya-KuJP,Yokohama JP,Saratoga CA US,Santa Clara CA US,Cupertino CA US
国籍：US,US,JP,JP,JP,JP,US,US,US
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